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Title:
LIGHTWEIGHT INORGANIC BOARD MOLDING AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH11268950
Kind Code:
A
Abstract:

To obtain an inexpensive inorganic board molding having high compression strength characteristics irrespective of having a lightweight of ≤0.6 g/cm3 density, excellent water resistance, incombustibility and heat insulating properties, useful as a core material for a functional composite building material.

This method for producing a lightweight inorganic board molding comprises primarily molding a composition consisting of 50-90 vol.% of a lightweight inorganic aggregate having 1-300 μm average particle diameter and 0.05-0.6 g/cm3 bulk density and 10-50 vol.% of the following binder composition for adhesion through a batch and/or continuous type mold from which a molding can be removed and dehydrating and drying and/or baking the primarily molding in a temperature atmosphere from room temperature to <1,000°C. The lightweight inorganic board molding product is obtained from the method. The binder composition for adhesion comprises a heterogeneous solution composition comprising alkali water glass, a water glass hardening agent, a water-soluble organic polymer showing properties of compatibilizing and/or emulsifying with water in any ratio and water, forms a double phase structure composed of a sea phase-island phase in the solution before gelatinization and can form a solidified hydrous gel reflecting the double phase structure.


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Inventors:
KITAMURA TADASHI
KUROKI HIDEKI
AOKI MASAYOSHI
Application Number:
JP7077098A
Publication Date:
October 05, 1999
Filing Date:
March 19, 1998
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
B32B13/02; C04B14/02; C04B28/26; C04B32/00; C04B40/02; C04B41/80; (IPC1-7): C04B28/26; B32B13/02; C04B14/02; C04B32/00; C04B40/02; C04B41/80