To obtain an inexpensive inorganic board molding having high compression strength characteristics irrespective of having a lightweight of ≤0.6 g/cm3 density, excellent water resistance, incombustibility and heat insulating properties, useful as a core material for a functional composite building material.
This method for producing a lightweight inorganic board molding comprises primarily molding a composition consisting of 50-90 vol.% of a lightweight inorganic aggregate having 1-300 μm average particle diameter and 0.05-0.6 g/cm3 bulk density and 10-50 vol.% of the following binder composition for adhesion through a batch and/or continuous type mold from which a molding can be removed and dehydrating and drying and/or baking the primarily molding in a temperature atmosphere from room temperature to <1,000°C. The lightweight inorganic board molding product is obtained from the method. The binder composition for adhesion comprises a heterogeneous solution composition comprising alkali water glass, a water glass hardening agent, a water-soluble organic polymer showing properties of compatibilizing and/or emulsifying with water in any ratio and water, forms a double phase structure composed of a sea phase-island phase in the solution before gelatinization and can form a solidified hydrous gel reflecting the double phase structure.
JPS57212047 | METHOD OF MOLDING REINFORCED FIBER BOARD |
KUROKI HIDEKI
AOKI MASAYOSHI