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Title:
LINEAR MATERIAL BUNDLE AND MANUFACTURING METHOD FOR THE SAME
Document Type and Number:
Japanese Patent JP2003135232
Kind Code:
A
Abstract:

To provide a wire bundle and a manufacturing method for it, freely shaped, having decorative property in itself, and capable of easily and stably supporting flowers and grasses in an arbitrary attitude and position.

A wire 1 whose circular section is partially cutout, and in which the cutout surface is irregularly continuously formed in the longitudinal direction is balled up to form the wire bundle A. When the wire bundle is put in a vase 5 and the stalk 3 of the flower or the grass 6 is put therein, a space (c) is deformed to receive the stalk, and the stalk is pressed by restoring force of the wire depending on its elastic force. Thus, the flowers and grasses can be supported in arbitrary attitude and position by pressing of a number of wires in the longitudinal direction of the stalk.


Inventors:
IWABUCHI TAKAKO
Application Number:
JP2001335654A
Publication Date:
May 13, 2003
Filing Date:
October 31, 2001
Export Citation:
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Assignee:
IWABUCHI TAKAKO
International Classes:
A01G9/12; A47G7/02; (IPC1-7): A47G7/02; A01G9/12
Attorney, Agent or Firm:
Kazuo Chikajima (1 person outside)



 
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