PURPOSE: To obtain a liquid adhesive for electronic components which performs bonding at relatively low temperatures and provides excellent heat resistance, reliability, etc., by dissolving an adhesive component comprising a specified siloxane-modified poly-amideimide resin in an organic solvent.
CONSTITUTION: An adhesive component comprising a siloxane-modified polyamideimide resin having a weight-average molecular weight of 1,000-50,000 and having an arrangement comprising 0.1-99.8wt.% polyamideimide structural units having a weight-average molecular weight of 800-30,000 and represented by formula I, 0.1-99.8wt.% polysiloxaneimide structural units having a weight- average molecular weight of 500-15,000 and represented by formula II and 0.1-99.8wt.% imide structural units represented by formula III is thoroughly dissolved in an organic solvent (e.g. tetrahydrofuran) to obtain a liquid adhesive for bonding an electronic component (e.g. semiconductor chip). In formulas I, II and III, A1 to A4 are each a group of formula IV or V or the like; R1 and R2 are each H, a halogen, a lower alkyl or the like; and X is a direct bond, a 1-6 C alkylene or the like.
KOBAYASHI MASAHARU
NISHIGAYA TAKESHI
YAMANASHI FUMIYOSHI
| JPH06271674A | 1994-09-27 | |||
| JPS63264632A | 1988-11-01 | |||
| JPH05275568A | 1993-10-22 | |||
| JPH02158681A | 1990-06-19 | |||
| JPH06271673A | 1994-09-27 |