Title:
LIQUID APPLIED TO FORM CONDUCTIVE FILM AND USAGE OF THE SAME
Document Type and Number:
Japanese Patent JP3882419
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide coating liquid that shows excellent in dispersion stability in a state of liquid and can form a conductive film that is excellent in conductivity and weatherability by a low-temperature heat treatment.
SOLUTION: In liquid according to the invention, metallic film particles are dispersed by reducing and precipitating the same by adding a reducing agent to such liquid that contains water soluble resin formed of metallicious and cellulose derivative (for example, hydroxyl propyl cellulose) and by making the water soluble resin gelled through a heat treatment.
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Inventors:
Keisuke Abe
Yasuhiro Sanada
Takemiya Satoshi
Hisao Inokuma
Yasuhiro Sanada
Takemiya Satoshi
Hisao Inokuma
Application Number:
JP26606899A
Publication Date:
February 14, 2007
Filing Date:
September 20, 1999
Export Citation:
Assignee:
Asahi Glass Co., Ltd.
International Classes:
H01J9/20; B05D7/24; B22F9/24; H01J29/88; H05K9/00; (IPC1-7): H01J9/20; B05D7/24; B22F9/24; H01J29/88; H05K9/00
Domestic Patent References:
| JP63076247A | ||||
| JP6310058A | ||||
| JP7258862A | ||||
| JP10001777A | ||||
| JP10182191A | ||||
| JP2001019801A |
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