Title:
LIQUID COMPOSITION, PREPREG, METAL SUBSTRATE WITH RESIN, WIRING BOARD AND SILICA PARTICLE
Document Type and Number:
Japanese Patent JP2023164340
Kind Code:
A
Abstract:
To provide a liquid composition and so on capable of forming a cured material excellent in adhesion to a metal substrate layer.SOLUTION: There is provided a liquid composition containing: a thermosetting resin; and silica particles having a water vapor adsorption amount of 0.01 to 10.00 cm3/g at a relative water vapor pressure of 0.8 in a water vapor adsorption isotherm at 25°C, and when a moisture amount based on mass after standing still for 24 hours in an environment of a temperature of 85°C and a relative humidity of 85% is A, and a moisture amount based on mass after standing still for 24 hours in an environment of a temperature of 25°C and a relative humidity of 50% after standing for 24 hours under an environment of temperature of 85°C and relative humidity of 85% is B, a moisture retention fluctuation amount of 20% or less as determined by (A-B)/A×100.SELECTED DRAWING: None
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Inventors:
KAMO HIROMICHI
Application Number:
JP2023070443A
Publication Date:
November 10, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
AGC INC
AGC SI TECH CO LTD
AGC SI TECH CO LTD
International Classes:
C08L101/00; B32B15/08; C01B33/18; C08J5/24; C08K3/36; C08K7/14; C08L25/00; C08L63/00; C08L71/12; H05K1/03
Attorney, Agent or Firm:
Patent Attorney Corporation Taiyo International Patent Office