To provide a liquid-cooled power convertor, in which the wiring mounting inductance between a film capacitor and a semiconductor stack is reduced, and the handleability of the semiconductor stack is improved.
A semiconductor element 12 employs a liquid-cooled system, in which a refrigerant is circulated by a pump 18 for heat transport, so that only a cooling body 13, that receives heat loss of the semiconductor element 12, is used as a cooling equipment housed in a semiconductor stack 3a. A heat exchanger 16, which acts as a heat radiation side that releases heat loss into the atmosphere, is installed at a location separated from the semiconductor stack 3a. Since the heat exchanger section is set away from the semiconductor stack, the wiring between a filter capacitor 6 and the semiconductor stack 3a is arranged for easy maintenance. The entire depth part in the attaching direction of the semiconductor stack to an equipment case is used for electrical connection to the filter capacitor, resulting in a low-inductance mounting.
IDE YUJI
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Yasuo Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Nakamura Tomoyuki
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
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