Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LIQUID-COOLED TYPE SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0661391
Kind Code:
A
Abstract:

PURPOSE: To enable heat released from a semiconductor chip to be dissipated through a shorter dissipating path so as to enhance a liquid-cooled type semiconductor device in cooling efficiency by a method wherein a liquid coolant path through which liquid coolant flows is provided inside a package where a semiconductor is sealed.

CONSTITUTION: A liquid coolant path 4 is provided at a part of a member possessed of a side where a semiconductor chip 5 of a package 1 is provided, and liquid coolant is made to flow through the liquid coolant path 4.


Inventors:
HOSHI MASAAKI
OBARA TETSUJI
NONAMI HIDEAKI
Application Number:
JP1992000211304
Publication Date:
March 04, 1994
Filing Date:
August 07, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI LTD
HITACHI VLSI ENG
International Classes:
H01L23/473; (IPC1-7): H01L23/473
Attorney, Agent or Firm:
Akita Aki