LIQUID-COOLED TYPE SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

Title:

LIQUID-COOLED TYPE SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JPH0661391

Kind Code:

A

Abstract:

PURPOSE: To enable heat released from a semiconductor chip to be dissipated through a shorter dissipating path so as to enhance a liquid-cooled type semiconductor device in cooling efficiency by a method wherein a liquid coolant path through which liquid coolant flows is provided inside a package where a semiconductor is sealed.

CONSTITUTION: A liquid coolant path 4 is provided at a part of a member possessed of a side where a semiconductor chip 5 of a package 1 is provided, and liquid coolant is made to flow through the liquid coolant path 4.

Inventors:

HOSHI MASAAKI
OBARA TETSUJI
NONAMI HIDEAKI

Application Number:

JP21130492A

Publication Date:

March 04, 1994

Filing Date:

August 07, 1992

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HITACHI LTD
HITACHI VLSI ENG

International Classes:

H01L23/473; (IPC1-7): H01L23/473

Attorney, Agent or Firm:

Akita Aki

Next Patent: SEMICONDUCTOR DEVICE LEAD FRAME