Title:
LIQUID DISCHARGE HEAD AND SILICON SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2016221688
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid discharge head which has a narrow space between supply passages and achieves good bubble releasability.SOLUTION: A liquid discharge head includes: a substrate 1 having supply passages 8 which penetrate through a first surface of the substrate 1 and a second surface opposite to the first surface; and a member which is bonded to the second surface of the substrate 1 through an adhesion. An inner wall of each supply passage 8 has a portion 9 which is arranged substantially parallel to the second surface.SELECTED DRAWING: Figure 1
Inventors:
KISHIMOTO KEISUKE
YONEMOTO TAICHI
YONEMOTO TAICHI
Application Number:
JP2015107163A
Publication Date:
December 28, 2016
Filing Date:
May 27, 2015
Export Citation:
Assignee:
CANON KK
International Classes:
B41J2/14; B41J2/16
Attorney, Agent or Firm:
Akio Miyazaki
Masaaki Ogata
Masaaki Ogata
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