To reduce the size of an apparatus by forming into a solid body a connecting structure to an external wiring circuit of a matrix arrangement substrate with element chips arranged in matrix and mounted thereon.

A plurality of the element chips 2 arranged in matrix in a row direction as a direction of a printing width of each element chip and in a column direction orthogonal to the row direction are mounted on a support 1. First, electrode parts of the element chips 2 located at a final end of each column and at a final end of each row are led out by a frame-like first wiring substrate 11 to the external wiring circuit. Then, a second wiring substrate 12 is superposed on the first wiring substrate 11, and electrode parts of the element chips 2 located at its inside are led outside. A third wiring substrate 13 and the subsequent wiring substrates are superposed and mounted similarly.