Title:
LIQUID DISPERSION DEVICE ARRANGED IN HEAT TRANSFER PIPE
Document Type and Number:
Japanese Patent JPH07103673
Kind Code:
A
Abstract:
PURPOSE: To provide a novel liquid dispersion device arranged in a heat transfer pipe having a certain devised configuration in which a flow-down liquid film is formed at an inner wall of a heat transfer pipe and a heat exchanger is easily manufactured with an excellent durability.
CONSTITUTION: A liquid dispersion device 1 arranged in a heat transfer pipe 2 is comprised of a projecting part 11, a flange part 12 and a leg 13. The projecting part 11 is provided with a plurality of openings 111 in its circumferential tangential direction and this new configuration of the liquid dispersion device 1 is installed in the heat transfer pipe 2.
Inventors:
KOJIMA YASUHIKO
YANAGISAWA YUZURU
YANAGISAWA YUZURU
Application Number:
JP24890493A
Publication Date:
April 18, 1995
Filing Date:
October 05, 1993
Export Citation:
Assignee:
TOYO ENGINEERING CORP
International Classes:
F28D3/02; F28D5/02; (IPC1-7): F28D3/02; F28D5/02
Domestic Patent References:
| JPS6037389A | 1985-02-26 | |||
| JPH0534461U | 1993-05-07 |
Attorney, Agent or Firm:
Hiroshi Masuda