Title:
LIQUID JET HEAD AND LIQUID JET DEVICE
Document Type and Number:
Japanese Patent JP2022149265
Kind Code:
A
Abstract:
To achieve downsizing of a liquid jet head and radiate heat of a driving circuit.SOLUTION: A liquid jet head includes: head chips which jet a liquid; a holder which holds the head chip; a circuit board which is arranged at a position such that the holder is disposed between the circuit board and the head chips; a passage structure which is disposed between the holder and the circuit board and provided with passages of the liquids to be supplied to the head chips; and a heat radiation member having a base part disposed between the holder and the passage structure. The head chip has a wiring member connected to the circuit board. The wiring member has a driving circuit. The passage structure has an opening into which the wiring member is inserted. At least a part of the driving circuit is located in the opening. The heat radiation member has a folded part extending from the base part in a direction along an inner wall surface of the opening. The folded part is thermally connected to the driving circuit.SELECTED DRAWING: Figure 9
Inventors:
MURAKAMI KENTARO
OKUBO KATSUHIRO
KANEGAE TAKAKIMI
UESAWA HARUHISA
KOBAYASHI HIROKI
TOMIMATSU SHINGO
OKUBO KATSUHIRO
KANEGAE TAKAKIMI
UESAWA HARUHISA
KOBAYASHI HIROKI
TOMIMATSU SHINGO
Application Number:
JP2021051328A
Publication Date:
October 06, 2022
Filing Date:
March 25, 2021
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/14; B41J2/01; B41J2/17
Attorney, Agent or Firm:
Ochi International Patent Office
Previous Patent: JPWO2022149264
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