Title:
液状封止材、それを用いた電子部品
Document Type and Number:
Japanese Patent JP6415104
Kind Code:
B2
Abstract:
This liquid sealing material has low thermal expansion and has injection properties for injection into gaps between a semiconductor element and a substrate; this electronic component is formed by sealing a sealing site using the liquid sealing material. This liquid sealing material is characterized by containing (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler with an average particle diameter of 7-50 nm, surface treated with 2-(3,4-epoxy cyclohexyl) ethyl trimethoxysilane, and (D) a silica filler with an average particle diameter of 0.2-5 μm, wherein relative to a total of 100 parts by mass of all components of the liquid sealing material, the total of the silica filler of component (C) and the silica filler of the component (D) is 45-77 parts by mass, and the mixing ratio (weight ratio) of the silica filler of component (C) and the silica filler of component (D) is 1:10.2-1:559.
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Inventors:
Ogawa Hideaki
Application Number:
JP2014101923A
Publication Date:
October 31, 2018
Filing Date:
May 16, 2014
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
C09K3/10; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2011014885A | ||||
| JP2011202177A | ||||
| JP2004111519A | ||||
| JP11166105A | ||||
| JP2001234031A | ||||
| JP2000319633A |
Foreign References:
| WO2009008283A1 |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Haruko Sanwa
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