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Patent Searching and Data


Title:
LIQUID EPOXY RESIN COMPOSITION AND LIQUID EPOXY RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2015151457
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition that facilitates releasing from a mold (mold removal), and a liquid epoxy resin molding material excellent in continuous molding property.SOLUTION: The liquid epoxy resin composition comprises (A) a liquid epoxy resin and (B) a liquid silicone. It is preferable that the (B) liquid silicone has a kinetic viscosity of 100 mm/s or more and 30,000 mm/s or less at 25°C. The liquid epoxy resin molding material is obtained by mixing and/or kneading the liquid epoxy resin composition.

Inventors:
KOBAYASHI TATSURO
Application Number:
JP2014026055A
Publication Date:
August 24, 2015
Filing Date:
February 14, 2014
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO LTD
International Classes:
C08L63/00; C08G59/20; C08G59/42; C08K3/00; C08L83/04
Domestic Patent References:
JPH10168288A1998-06-23
JP2005171445A2005-06-30
JPH08217857A1996-08-27
JPH06279654A1994-10-04
JP2005272824A2005-10-06
JPH0841168A1996-02-13
JP2005154766A2005-06-16
JPS60106827A1985-06-12