Title:
液状エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP4583821
Kind Code:
B2
Abstract:
This invention relates to a liquid epoxy resin composition which shows excellent adhesiveness, low content of ionic contaminants and good storage stability and is particularly suitable as a material for flip chip packaging and adhesion of substrates. The composition comprises epoxy resin (A) which is liquid at normal temperatures and comprises epoxy resin (A1) represented by the following formula (1) and epoxy resin (A2) having two or more glycidyl ether groups in the molecule, hardeners (B) selected from one kind or more of curing agents and curing catalysts as main ingredients and 0.1-5 wt % of solvent (C) and the content of epoxy resin (A1) in epoxy resin (A) is in the range of 5-75 wt %; at least one of the groups R1-R5 in formula (1) is a group represented by the following general formula (2) and the remainder is hydrocarbon groups containing 1-6 carbon atoms or hydrogen atoms.
Inventors:
Hisashi Katayama
Ken Ichida
Hiroyuki Takahashi
Anzai Masaru
Ken Ichida
Hiroyuki Takahashi
Anzai Masaru
Application Number:
JP2004189681A
Publication Date:
November 17, 2010
Filing Date:
June 28, 2004
Export Citation:
Assignee:
Nippon Steel Chemical Co., Ltd.
International Classes:
C08G59/22; C08G59/24; C08G59/38; C08K3/20; C08L63/00; C09J11/00; C09J163/00; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| JP5001265A | ||||
| JP4053821A | ||||
| JP2003138100A | ||||
| JP2004083711A | ||||
| JP10195402A | ||||
| JP11265960A | ||||
| JP2000327884A | ||||
| JP2003212964A |
Attorney, Agent or Firm:
Katsuo Naruse
Tomohiro Nakamura
Eiichi Sano
Tomohiro Nakamura
Eiichi Sano