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Title:
LIQUID EPOXY RESIN, PRODUCTION OF LIQUID EPOXY RESIN, EPOXY RESIN COMPOSITION AND ITS CURED MATERIAL
Document Type and Number:
Japanese Patent JP2000143769
Kind Code:
A
Abstract:

To obtain the subject liquid resin capable of providing a solidified material having excellent heat resistance and water resistance, containing a small amount of hydrolyzable chlorine, having low viscosity, useful as an electric/electronic part by specifying the amount of hydrolyzable chlorine.

This resin comprises a compound of formula I having ≤2,000 ppm hydrolyzable chlorine amount when refluxed in 1N solution of sodium hydroxide in ethanol for 30 minutes and titrated with 0.01N aqueous solution of silver nitrate. The resin is obtained by a method including a process for reacting a compound of formula II with an excessive epihalohydrin in the presence of a quaternary ammonium salt (e.g. tetramethylammonium chloride, etc.), and a solid alkali metal hydroxide (e.g. sodium hydroxide, etc.), at 20-70°C with stirring, for example, for about 3-25 hours.


Inventors:
AKATSUKA YASUMASA
NAKAYAMA KOJI
OSHIMI KATSUHIKO
Application Number:
JP31823998A
Publication Date:
May 26, 2000
Filing Date:
November 10, 1998
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
C08G59/04; (IPC1-7): C08G59/04
Domestic Patent References:
JPH11199645A1999-07-27
JPH107761A1998-01-13
JPH06136092A1994-05-17
JPH04142326A1992-05-15
JPH08134178A1996-05-28
JPS5731921A1982-02-20