Title:
液体噴射ヘッド、液体噴射装置、及び、電子デバイス
Document Type and Number:
Japanese Patent JP7087511
Kind Code:
B2
Abstract:
To provide a liquid injection head which reduces an electric resistance value of wiring and can reliably connect external wiring to the wiring, and a liquid injection device and an electronic device.SOLUTION: A liquid injection head comprises: a flow passage forming substrate provided with a pressure generating chamber communicating with a nozzle; a driving element being provided to the flow passage forming substrate and generating a pressure change in the pressure generating chamber; and a wiring board 30 provided with wiring 32 to which a terminal part 131a of external wiring 131 is connected. The wiring comprises: embedded wiring 321 embedded in a groove 304 provided to the wiring board; and connection wiring 322 covering a surface of the embedded wiring. In a plan view from a direction Y of the wiring 32 in a plane 301 provided with the wiring 32 of the wiring board 30, the embedded wiring 321 and the terminal part 131a of the external wiring 131 are disposed at an overlapping position, and, in the direction Y of the wiring 32, a center of the embedded wiring 321 and a center of the terminal part 131a of the external wiring 131 are provided at different positions. The terminal part 131a is provided without straddling the embedded wiring 321.SELECTED DRAWING: Figure 8
Inventors:
Daisuke Yamada
Eiki Hirai
▲高▼部 本規
Shunsuke Watanabe
Shingo Tomimatsu
Eiki Hirai
▲高▼部 本規
Shunsuke Watanabe
Shingo Tomimatsu
Application Number:
JP2018052132A
Publication Date:
June 21, 2022
Filing Date:
March 20, 2018
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B41J2/14; B41J2/16
Domestic Patent References:
| JP2018001418A | ||||
| JP2017124540A | ||||
| JP2016165847A | ||||
| JP2005209757A |
Attorney, Agent or Firm:
Satoshi Nakai
Hiroki Matsuoka
Masayuki Imamura
Hiroki Matsuoka
Masayuki Imamura