Title:
固形物から物質を除去するための液体ジェットガイド式エッチング法およびその使用
Document Type and Number:
Japanese Patent JP2009542022
Kind Code:
A
Abstract:
The present invention relates to a method for removing material from solids by liquid jet-guided etching. The method according to the invention is used in particular for cutting, microstructuring, doping of wafers or also the metallisation thereof.
Inventors:
Meyer Kuno
Kolbesen Bernau
Kolbesen Bernau
Application Number:
JP2009517022A
Publication Date:
November 26, 2009
Filing Date:
July 02, 2007
Export Citation:
Assignee:
Fraunhofer-Gesellschaft Tour Foderung del Angewanten Forcing A. Fau.
Johann Wolfgang Goethe Universitate Frankfurt am Main
Johann Wolfgang Goethe Universitate Frankfurt am Main
International Classes:
B01J35/02; H01L21/306; C01B33/03; C23F1/10; H01L21/308
Domestic Patent References:
| JPS59225896A | 1984-12-18 | |||
| JP2005534545A | 2005-11-17 | |||
| JPS6122633A | 1986-01-31 | |||
| JP2003529675A | 2003-10-07 | |||
| JPS58125677A | 1983-07-26 | |||
| JP2000094163A | 2000-04-04 | |||
| JPH06260477A | 1994-09-16 | |||
| JP2006098421A | 2006-04-13 | |||
| JPH02501719A | 1990-06-14 |
Foreign References:
| WO2007058284A1 | 2007-05-24 | |||
| WO2005091347A1 | 2005-09-29 | |||
| WO2003000456A2 | 2003-01-03 |
Attorney, Agent or Firm:
Tamio Nishiwaki