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Title:
LIQUID JET HEAD MODULE AND LIQUID JET DEVICE
Document Type and Number:
Japanese Patent JP2014188815
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a liquid jet head module enabling size reduction of a head module; and a liquid jet device including the module.SOLUTION: A unit head 26 includes a head body 34 having a nozzle surface, and a substrate case 33 that has a fix surface 40 to be fixed to a fixing frame 31 of a frame 25 and accommodates a relay substrate 36; the fix surface of the substrate case is formed at a position closer to a surface opposite to the fixing frame than a side surface 34' of the head body 34 on the fix surface side; the head body is positioned closer to an ink jetting side than the fixing frame in the state of the fix surface being fixed to the fixing frame; one end portion of a first cable 37 whose the other end portion is connected to an electrode terminal of a piezoelectric element is connected to the relay substrate; and a second cable 38 connected to the relay substrate is extracted from a position close to a surface opposite to the fix surface toward an opposite side of the nozzle surface, and the other end portion of the second cable is connected to a drive substrate 28.

Inventors:
HAGIWARA HIROYUKI
OWAKI HIRONARI
Application Number:
JP2013065815A
Publication Date:
October 06, 2014
Filing Date:
March 27, 2013
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/045; B41J2/055
Domestic Patent References:
JP2005096146A2005-04-14
JP2000351211A2000-12-19
JP2004243664A2004-09-02
JP2005096146A2005-04-14
JP2000351211A2000-12-19
JP2004243664A2004-09-02
Attorney, Agent or Firm:
Masaaki Kamiyanagi
Kazuhiko Miyasaka
Kazuaki Watanabe



 
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