Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LIQUID MOLD AGENT, AND METHOD FOR PRODUCING LIQUID MOLD AGENT
Document Type and Number:
Japanese Patent JP2014152314
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a liquid mold agent in which components are dispersed while suppressing the increase of viscosity after production.SOLUTION: Provided is a method for producing a liquid mold agent comprising: (A) an epoxy resin; (B) an acid anhydride hardening agent; and (C) inorganic fillers, in which the ratio of the (C) component is 80 to 91 pts.mass to 100 pts.mass of the liquid mold agent. The (C) component includes at least two kinds of inorganic fillers with different average particle diameters, and the (A) component, the (B) component and the (C) component are mixed at 15 to 45°C under 0.0001 to 50 kPa.

More Like This:
JP2631828PRODUCTION OF CURABLE PRECONDENSATE
WO/2001/010926TRANSPARENT LIQUID RESIN MATERIAL FOR SMT-ENABLED LED-APPLICATIONS AT HIGHER TEMPERATURES AND HIGHER LUMINOSITIES
JPH09249737EPOXY RESIN COMPOSITION, POWDER COATING MATERIAL AND ARTICLE
Inventors:
YOKOYAMA RUKA
KAMIMURA TAKESHI
HONMA HIROKI
ARAO KEI
Application Number:
JP2013025867A
Publication Date:
August 25, 2014
Filing Date:
February 13, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NAMICS CORP
International Classes:
C08G59/42; C08G59/58; C08K3/00; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
JPS6119620A1986-01-28
JPH09286840A1997-11-04
JP2010118649A2010-05-27
JP2010100726A2010-05-06
JPH03115423A1991-05-16
Foreign References:
WO2009142065A12009-11-26
US20110105646A12011-05-05
Attorney, Agent or Firm:
Yuusuke Watarai



 
Previous Patent: RESIN COMPOSITION AND RESIN MOLDING

Next Patent: VISCOSITY INDEX IMPROVER AND LUBRICANT COMPOSITION