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Title:
LIQUID PHASE DIFFUSION BONDING OF DISSIMILAR METALS
Document Type and Number:
Japanese Patent JP2007038298
Kind Code:
A
Abstract:

To provide improved liquid phase diffusion bonding of dissimilar metals, more particularly, of copper or a copper alloy to a non-copper alloy.

In the method for forming a component, a braze material is assembled between first and second wall portions to form a sandwich. The first wall portion consists essentially of copper or a copper-based alloy. The second wall portion comprises at least one non-copper-based alloy. The sandwich is heated. The heating melts the braze material to cause a liquid phase diffusion bonding of at least a portion of the first wall portion to the second wall portion.


Inventors:
WATKINS WILLIAM B
BARONE JOSEPH C
Application Number:
JP2006205496A
Publication Date:
February 15, 2007
Filing Date:
July 28, 2006
Export Citation:
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Assignee:
UNITED TECHNOLOGIES CORP
International Classes:
B23K20/00; B23K20/14; B23K20/22; B23K20/24; B23K35/30; C22C19/03; C22C19/05; F02K9/62; F28F3/08; F28F21/08; B23K101/14; B23K103/22
Attorney, Agent or Firm:
Tsuyoshi Hashimoto
Tomioka Kiyoshi