Title:
LIQUID PHASE DIFFUSION BONDING METHOD
Document Type and Number:
Japanese Patent JP2022014737
Kind Code:
A
Abstract:
To provide a liquid phase diffusion bonding method that can inhibit poor filling of a joining layer for joining Cu wiring and a semiconductor chip together.SOLUTION: In a liquid phase diffusion bonding method, a first thin film 50 made of Sn with a thickness of 5 μm, and a second thin film 51, in which Cu is added to an Sn thin film with a thickness of 5 μm, are sandwiched between Cu wiring 22 and a semiconductor chip 30. The Sn thin film 50 is arranged on the side of the semiconductor chip 30. An Sn-Cu thin film 51, in which Cu is added to the Sn thin film, is arranged on the side of the Cu wiring 22. A joining layer is formed by heating the first and second thin films.SELECTED DRAWING: Figure 2
Inventors:
MAENO KAZUHIRO
Application Number:
JP2020117256A
Publication Date:
January 20, 2022
Filing Date:
July 07, 2020
Export Citation:
Assignee:
TOYOTA IND CORP
International Classes:
H01L21/52; B23K20/00; B23K35/14; B23K35/26
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda
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