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Patent Searching and Data


Title:
LIQUID PHASE DIFFUSION JOINING METHOD
Document Type and Number:
Japanese Patent JPH02121782
Kind Code:
A
Abstract:

PURPOSE: To prevent the deterioration of strength of a joined part by carrying cut wet plating on the joining face of members to be joined and forming plated layers consisting of ≥3 elements in all with ≥1 element selected from metal of Ni, etc., and ≥1 element of P, B and Si of composition having two elements at an eutectic point.

CONSTITUTION: The wet plating is carried out on one joining face at least of the members to be joined. The plated layers consisting of ≥3 elements in all with ≥1 element among Ni, Cr, Co, Cu, Fe and W and ≥1 element among P, B and Si are composed of two elements at least at an eutectic point. When the plated layers 14 and 16 are formed on the members 10 and 12 to be joined made of a Ni alloy, etc., these plated layers have composition of 85 Ni-11P-4B, etc., having three elements at an eutectic point. After being pressed and stuck to each other by a hot press with the plated layers between, the members 10 and 12 to be joined are heated and held for the prescribed time at the prescribed temperature in a vacuum or inert gas atmosphere and joined homogeneously therein. By this method, the melting point of the plated layers is lowered suitably and the deterioration of strength of the joined members can be effectively prevented.


Inventors:
FUKUDA KAZUJI
MIZUNO SHIGERU
Application Number:
JP27569988A
Publication Date:
May 09, 1990
Filing Date:
October 31, 1988
Export Citation:
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Assignee:
BROTHER IND LTD
International Classes:
B23K20/00; B23K1/00; (IPC1-7): B23K1/00; B23K20/00
Attorney, Agent or Firm:
Haruyuki Ikeda (2 outside)