To make application between wafers W uniform, by stabilizing the supply amount of treatment liquid, when the treatment liquid is supplied from a treatment liquid nozzle 11 to wafers W placed on a liquid treatment module 2 to perform liquid treatment.

When a nozzle 11 stands by in a nozzle bath 15, suck back is performed by a such-back valve 52 by a fixed amount to raise a liquid surface of s resist liquid at a tip end portion of the nozzle 11. After the nozzle 11 is moved to above a liquid treatment module 2, a camera 16 provided at an arm 13 for supporting the nozzle 11 images the tip end portion of the nozzle 11 to obtain image data. On the basis of the image data, a liquid surface level is detected, and the suck-back valve 52 is controlled according to the detection result so as to make the liquid surface level become a reference level set in advance. Therefore, the liquid surface level before resist discharge is fixed, and the discharge amount of the treatment liquid is fixed.