Title:
LIQUID PUMP
Document Type and Number:
Japanese Patent JP2015135108
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To suppress peeling of a seal material for sealing between a resinous motor housing and a metallic case.SOLUTION: In a seal structure 100 of a water pump, a stepped portion 43A is formed on an inner peripheral surface of a surrounding wall 43. The stepped portion 43A includes a stepped surface 43Ac, and the stepped surface 43Ac is extended from a base end side inner peripheral surface 43Aa in a direction separating from an opening end portion 98 of a circuit cover 98. If the surrounding wall 43 extends in a direction separating from the opening end portion 98C of the circuit cover 98 under a high temperature condition, between a seal material 104 and the stepped surface 43Ac, the application of a tensile load is suppressed, and a shear load in a direction along the stepped surface 43Ac is mainly applied. Therefore, the peel strength of the seal material 104 on the stepped surface 43Ac can be made to be higher than the peed strength of the seal material 104 on the base end side inner peripheral surface 43Aa. Consequently, the peed strength to the surrounding wall 43 to the seal material 104 can be improved.
Inventors:
TAKEMURA YUJI
IGARASHI KEIICHI
IGARASHI KEIICHI
Application Number:
JP2014249113A
Publication Date:
July 27, 2015
Filing Date:
December 09, 2014
Export Citation:
Assignee:
ASMO CO LTD
International Classes:
F04D29/08; F04D13/06; H02K5/10
Domestic Patent References:
| JP4428593B2 | 2010-03-10 | |||
| JP2001085866A | 2001-03-30 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda
Kato Kazunori
Hiroshi Fukuda
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