Title:
LIQUID RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003342449
Kind Code:
A
Abstract:
To provide a liquid resin composition which is freed from the problem of a conventional pourable sealing underfill material and therefore has both reduced void formation tendency and high adhesion.
The liquid resin composition comprises a normally liquid epoxy resin and/or a normally liquid cyanate ester, a curing agent, an inorganic filler, and a silane coupling agent having a methoxyl group and/or an ethoxyl group, wherein the amount of methanol and/or ethanol evaporated from the silane coupling agent is at most 200 ppm based on the weight of the liquid resin composition.
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Inventors:
WADA MASAHIRO
Application Number:
JP2002152803A
Publication Date:
December 03, 2003
Filing Date:
May 27, 2002
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08J3/20; C08G59/20; C08K3/00; C08K5/541; C08L63/00; C08L79/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/20; C08J3/20; C08K3/00; C08K5/541; C08L79/00; H01L23/29; H01L23/31
Domestic Patent References:
| JPH07122683A | 1995-05-12 | |||
| JP2002097342A | 2002-04-02 | |||
| JP2000273287A | 2000-10-03 | |||
| JPH11106481A | 1999-04-20 | |||
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| JP2001302767A | 2001-10-31 |