To provide high reliability in a semiconductor device manufactured in a wafer level process formed into a wafer shape with a wafer level package, especially by compression molding.

The liquid resin composition includes (A) an alicyclic epoxy resin, (B) a curing agent for epoxy resin (C) an inorganic filling material and (D) a hardening accelerator. In the liquid resin composition, (C) the inorganic filling material is contained at ≥80 wt.% and ≤95 wt.% in the total liquid resin composition and has a viscosity at 25°C of 50 Pas or more and 500 Pas or less.