To provide a liquid resin composition having a low linear heat-expansion, a low elastic modulus at room temperature, and high reliability, and being excellent in a repletion into a narrow gap, in an underfill material of a flip-chip semiconductor device.

There is provided a liquid sealing resin composition containing a liquid epoxy resin (A), an amine curing agent (B), an acrylic resin (C), and an inorganic filler (D). In the liquid resin composition, preferably the content of the acrylic resin (C) is ≥0.5 wt.% and ≤20 wt.%, and the acrylic resin (C) is composed of an acrylic copolymer containing a plurality of different monomer components.