Title:
LIQUID SEALING TYPE MOUNT
Document Type and Number:
Japanese Patent JPH1151109
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent delay in the attenuation operation of low frequency vibration without moving and elastically deforming a subdiaphragm when its operation is unnecessary by setting a first valve close condition, a second valve close condition, and a valve open condition for opening and closing a second orifice and changing over opening and closing by a control member. SOLUTION: A control member 20 moves vertically at a predetermined stroke to change over opening and closing of a second orifice 13. In a first valve close condition, a valve element part 18 is closed and the control member 20 is in contact with a lower face of a subdiaphragm 17 on the whole face thereof. In a second valve close condition, the valve element 18 is closed and the control member 20 leaves downward so that the resonance operation of the subdiaphragm 17 become possible. When the control member 20 moves further downward, the valve element part 18 leaves a partition part 9 to open a valve. In the first valve close condition, high attenuation is obtained in a vibration region of large amplitude of a low frequency, and the subdiaphragm 17 provided to absorb high frequency vibration does not move and is not elastically deformed at all when its operation is unnecessary so as to prevent delay in the attenuation operation for low frequency vibration.
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Inventors:
YAESAWA KOJI
Application Number:
JP22294197A
Publication Date:
February 23, 1999
Filing Date:
August 06, 1997
Export Citation:
Assignee:
NOK MEGULASTIK CO LTD
International Classes:
F16F13/26; (IPC1-7): F16F13/26
Attorney, Agent or Firm:
Youichi Nomoto