Title:
LIQUID THERMOSETTING RESIN COMPOSITION, PREPREG AND METAL-CLAD LAMINATE
Document Type and Number:
Japanese Patent JP2009235123
Kind Code:
A
Abstract:
To provide an epoxy resin composition using a cyclic phenoxyphosphazene compound excellent in varnish stability as a flame retardant, and to provide a prepreg and a copper-clad laminate.
A thermosetting resin composition is used containing, as a flame retardant, a cyclic phenoxyphosphazene compound which is substituted by a group selected from a substituent represented by formula (II), cyanic ester-substituted phenoxide and methyl-substituted phenoxide and which is liquid at ordinary temperature.
Inventors:
INOUE HIROHARU
KASHIWABARA KEIKO
UNO MINORU
ISHIKAWA TOMOYUKI
ABE TAKATOSHI
KASHIWABARA KEIKO
UNO MINORU
ISHIKAWA TOMOYUKI
ABE TAKATOSHI
Application Number:
JP2008079145A
Publication Date:
October 15, 2009
Filing Date:
March 25, 2008
Export Citation:
Assignee:
PANASONIC ELEC WORKS CO LTD
International Classes:
C08K5/5399; B32B15/08; B32B15/14; C08J5/24; C08L85/02; C08L101/00; C09K21/12
Domestic Patent References:
| JP2002322478A | 2002-11-08 | |||
| JP2001192392A | 2001-07-17 |
Foreign References:
| WO2007080998A1 | 2007-07-19 |
Attorney, Agent or Firm:
Etsushi Kotani
Masataka Otani
Yoshio Asano
Masaru Egawa
Hiroto Onishi
Masataka Otani
Yoshio Asano
Masaru Egawa
Hiroto Onishi