Title:
LIQUID TRANSFER MOLDING METHOD
Document Type and Number:
Japanese Patent JPS54580
Kind Code:
A
Abstract:
PURPOSE:To transfer sealing resin of high viscosity by using vibrations and reducing fluid resistance.
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Inventors:
SAKAI KUNIHITO
SATOU FUMIHIKO
SATOU FUMIHIKO
Application Number:
JP6553677A
Publication Date:
January 05, 1979
Filing Date:
June 02, 1977
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K5/00; B29C43/00; B29C45/00; B29C45/02; B29C45/14; H01L21/56; H05K5/06; (IPC1-7): B29G3/00; H01L21/56; H05K5/06
Next Patent: SOUNDPROOF DEVICE OF CURRENT COLLECTOR FOR VEHICLE