Title:
液処理装置
Document Type and Number:
Japanese Patent JP7067950
Kind Code:
B2
Abstract:
A solution treatment apparatus includes: a substrate holding unit holds and rotates a substrate; a coating solution supply unit applies a coating solution to the substrate held by the substrate holding unit; a cup unit arranged outside the substrate holding unit in a manner to be able to surround the substrate held by the substrate holding unit; an exhaust path provided between the substrate holding unit and an inner peripheral surface of the cup unit; a coating solution collection unit provided above the exhaust path in a manner to cover the exhaust path and including an opening part communicating in a vertical direction; a solvent supply unit supplies a solvent for the coating solution to the coating solution collection unit; and a relay unit located above the coating solution collection unit and projecting from the inner peripheral surface of the cup unit toward the coating solution collection unit.
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Inventors:
Satoshi Niimura
Yuji Sakai
Kousuke Yoshihara
Yuji Sakai
Kousuke Yoshihara
Application Number:
JP2018025955A
Publication Date:
May 16, 2022
Filing Date:
February 16, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; B05C11/08; G03F7/16
Domestic Patent References:
| JP2016184644A | ||||
| JP3175893U | ||||
| JP63260025A | ||||
| JP61046028A | ||||
| JP56044066A |
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Koji Hagiwara
Naoki Ogita
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