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Title:
LITHOGRAPHY APPARATUS AND INTERNAL SPACE ADJUSTMENT METHOD OF DEVICE MANUFACTURING APPARATUS
Document Type and Number:
Japanese Patent JP2007096294
Kind Code:
A
Abstract:

To provide a lithography apparatus and an internal space adjustment method of device manufacturing apparatus.

The lithography apparatus comprises at least a first gas shower constituted so as to supply a first air current into an internal space of the lithography apparatus, and at least a second gas shower constituted so as to supply a second air current into the internal space of the lithography apparatus, wherein the first and second air currents are at least partially directed to one another by the gas shower. Further, there is provided a method of adjusting the internal space of a device manufacturing apparatus, wherein the first adjusted air current and the second adjusted air current are supplied to the internal space, so that they are at least partially directed to one another.


Inventors:
VAN EMPEL TJARKO ADRIAAN RUDOL
DER HAM RONALD V
ROSET NIEK JACOBUS JOHANNES
Application Number:
JP2006239753A
Publication Date:
April 12, 2007
Filing Date:
September 05, 2006
Export Citation:
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Assignee:
ASML NETHERLANDS BV
International Classes:
H01L21/027; G03F7/20
Domestic Patent References:
JP2000036453A2000-02-02
JPH05283313A1993-10-29
JPH07117371B21995-12-18
JPH10135132A1998-05-22
JPH11354434A1999-12-24
Foreign References:
EP1770444B12009-08-19
EP1347336A12003-09-24
WO2003105203A12003-12-18
Attorney, Agent or Firm:
Yoshiyuki Inaba
Shinji Oga
Toshifumi Onuki
Hideto Asamura
Hajime Asamura
Yutaka Yoshida
Toru Mori