LOAD APPLYING PAD AND LOAD APPLYING APPARATUS

Title:

LOAD APPLYING PAD AND LOAD APPLYING APPARATUS

Document Type and Number:

Japanese Patent JP2023104390

Kind Code:

A

Abstract:

To suppress a reduction in load resistant by reducing local concentration of stress.SOLUTION: A load applying pad to be mounted to a sample for applying a load to the sample, includes a back skin to be applied with the load, an elastic body provided between the back skin and the sample, and an insertion member provided between the elastic body and the sample. The back skin, the elastic body and the insertion member are integrally joined, and the insertion member is lower in rigidity than the sample, and higher in rigidity than the elastic body.SELECTED DRAWING: Figure 2

More Like This:

JP2009063501	METHOD AND APPARATUS FOR EVALUATING SURFACE-MODIFYING MATERIAL
WO/2023/080826	A WIND TURBINE SYSTEM AND A METHOD FOR PROVIDING MEASUREMENT DATA
JPS54151299	DATA COLLECTING AND PROCESSING METHOD AND ITS DEVICE

Inventors:

MORISHITA KUNIHIRO
YARI TAKASHI

Application Number:

JP2022005339A

Publication Date:

July 28, 2023

Filing Date:

January 17, 2022

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MITSUBISHI HEAVY IND LTD

International Classes:

G01M5/00

Attorney, Agent or Firm:

Sakai International Patent Office

Previous Patent: Plate-like part moving device

Next Patent: shock absorber