Title:
半導体集積回路装置用負荷駆動回路
Document Type and Number:
Japanese Patent JP4168941
Kind Code:
B2
Inventors:
Orchid Akifumi
Application Number:
JP2004018390A
Publication Date:
October 22, 2008
Filing Date:
January 27, 2004
Export Citation:
Assignee:
株式会社デンソー
International Classes:
B62D5/04; H03K17/687; H03K17/06
Domestic Patent References:
| JP5038134A | ||||
| JP2000307397A | ||||
| JP2002037099A |
Attorney, Agent or Firm:
Tsuyoshi Sato
Kiyoshi Ogawa
Kiyoshi Ogawa