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Title:
LOADING OF LEAD FRAME TO MOLD DEVICE IN ENCAPSULATION OF ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPS6270013
Kind Code:
A
Abstract:

PURPOSE: To automatically load lead frames by a method wherein the lead frames, which are positioned by set pins in the state, of being held by loading chucks, is lowered above the bottom force of a forming die so as to be dropped onto the bottom force by inserting pilot pins into the lead frames and by pulling the set pins.

CONSTITUTION: First, when the tips of lead frames 1 are brought into guide rail parts 41 by blowing-off the air from nozzles 36 in the state that the lead frames 1 correspond to feed rollers 28, the feed rollers 28 are put into drive so as to advance the lead frames 1 until the lead frames abut against stoppers 40. The abutments of the lead frames against the stoppers cause the feed rollers 28 to stop. At this time, set pins 26 are inserted in the positioning holes 45 of the lead frames 1 for positioning. Secondly, loading chucks 19, in which the lead frames 1 are held, are shifted to positions just above bottom forces 5 so as to lower an elevating body 15 in order to seat the loading chucks 19 onto the bottom forces 5. At this time, pilot pins 37 are inserted in positioning holes 46 so as to position the lead frames to the bottom forces 5. After that, the lead frames are placed onto the bottom forces 5 by pulling the set pins 26 out and opening the slide chucks 19b.


Inventors:
NAKAJO TOSHIJI
Application Number:
JP21079485A
Publication Date:
March 31, 1987
Filing Date:
September 24, 1985
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29C43/18; B29C45/02; B29C45/42; H01L21/56; B29L31/34; (IPC1-7): B29C43/18; B29C45/02; B29C45/42; B29L31/34
Attorney, Agent or Firm:
Ishida Choshichi