Title:
LOCAL PLATING DEVICE
Document Type and Number:
Japanese Patent JPH04280991
Kind Code:
A
Abstract:
PURPOSE:To form a bump for connecting the inner lead of TAB and a semiconductor chip with high quality and precision. CONSTITUTION:A fiber 12 is introduced into a nozzle 11 for forming the jet 4a of a plating soln. 4, and the part to be plated is directly irradiated with a laser beam 9 from the selected part of the fiber 12 without totally reflecting the beam in the jet 4a.
Inventors:
MORITA TAKESHI
FUJITA MINORU
SUNAMOTO MASATOSHI
HAYASHI OSAMU
HOSHINOUCHI SUSUMU
FUJITA MINORU
SUNAMOTO MASATOSHI
HAYASHI OSAMU
HOSHINOUCHI SUSUMU
Application Number:
JP4342891A
Publication Date:
October 06, 1992
Filing Date:
March 08, 1991
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C25D5/02; (IPC1-7): C25D5/02
Attorney, Agent or Firm:
Soga Doteru (6 people outside)