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Title:
LOOP HEAT PIPE, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2012233625
Kind Code:
A
Abstract:

To provide a high-performance loop heat pipe that is further thinner than a conventional one, and to provide a method for manufacturing the same.

The loop heat pipe includes: an evaporator 32 having an inner space in which a wick 43 is arranged; a condenser; a steam tube arranged between the evaporator 32 and the condenser and through which working fluid of a gas phase passes; and a liquid tube arranged between the condenser and the evaporator 32 and through which working fluid of a liquid phase passes. In addition, the wick 43 includes: a plate support on which a plurality of holes are provided for penetrating from one surface side to the other surface side; and a porous structure filling the hole of the support.


Inventors:
YOSHINO MAKOTO
TAKASU YOICHI
ABE TOMOYUKI
Application Number:
JP2011101751A
Publication Date:
November 29, 2012
Filing Date:
April 28, 2011
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
F28D15/02
Domestic Patent References:
JP2005300038A2005-10-27
JP2010107153A2010-05-13
JP2004077051A2004-03-11
JP2009109079A2009-05-21
JP2010096405A2010-04-30
JP2004095684A2004-03-25
Attorney, Agent or Firm:
Keizo Okamoto



 
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