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Title:
LOOP-TYPE HEAT PIPE AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2013057439
Kind Code:
A
Abstract:

To provide a loop-type heat pipe that can prevent deterioration in heat transportation efficiency due to bubbles, and to provide an electronic apparatus with the loop-type heat pipe.

The loop-type heat pipe 30 includes: an evaporator 31 storing a wick 36 formed of a porous body; a condenser 32; a steam pipe 33 disposed between the evaporator 31 and the condenser 32 and allowing a gas-phase working fluid to pass therethrough; a liquid pipe 34 disposed between the condenser 32 and the evaporator 31 and allowing a liquid-phase working fluid to pass therethrough; a pressure application unit 35, 41 operable to apply pressure to the liquid-phase working fluid in the evaporator 31; and a drive unit 42 for driving the pressure application unit 35, 41. Upon the drive unit 42 driving when bubbles are generated in the liquid-phase working fluid in the evaporator 31, pressure is applied to the liquid-phase working fluid in the evaporator 31 to make the bubbles pass through the wick 36 and pushed to the outside.


Inventors:
HIBINO SEIJI
TANIGUCHI ATSUSHI
KIMURA TAKAHIRO
Application Number:
JP2011195780A
Publication Date:
March 28, 2013
Filing Date:
September 08, 2011
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
F28D15/06; F28D15/02; H01L23/427
Domestic Patent References:
JP2006308163A2006-11-09
JP2002286386A2002-10-03
JPS6454678U1989-04-04
JPH09113160A1997-05-02
JPH01147290A1989-06-08
JPS5719780U1982-02-01
Foreign References:
US20050067146A12005-03-31
US5725049A1998-03-10
Attorney, Agent or Firm:
Keizo Okamoto



 
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