ジビニルベンゼンを含む、低密度のクラスAシートモールディングコンパウンド - Ashland Licensing and Intellectual Property LLC

Title:

ジビニルベンゼンを含む、低密度のクラスAシートモールディングコンパウンド

Document Type and Number:

Japanese Patent JP2008540188

Kind Code:

A

Abstract:

The present disclosure relates generally to resin formulations for sheet molding compounds. Particularly, but not by way of limitation, the invention relates to low-density thermosetting sheet molding compounds (SMC) comprising an organic-modified, inorganic clay, a thermosetting resin, a low profile agent, a reinforcing agent, a low-density filler, and substantially the absence of calcium carbonate. The present disclosure relates particularly to the use of alternative reactive monomers present as aromatic, multiethylenically-unsaturated compounds that aid thermosetting SMC in yielding exterior and structural thermoset articles, e.g. auto parts, panels, etc that have Class A Surface Quality.

Inventors:

Michael jay summer
Dennis H. Fisher

Application Number:

JP2008511181A

Publication Date:

November 20, 2008

Filing Date:

May 05, 2006

Export Citation:

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