Title:
ポリマーネットワークを有する低誘電率材料
Document Type and Number:
Japanese Patent JP2004504424
Kind Code:
A
Abstract:
A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.
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Inventors:
Lau, Chrysler
Liu, Huong Chi Yu Wan
Boroliv
Brooke, emma
The Yerebin, Ruslan
Nalehayek, David
Liu, Huong Chi Yu Wan
Boroliv
Brooke, emma
The Yerebin, Ruslan
Nalehayek, David
Application Number:
JP2002512266A
Publication Date:
February 12, 2004
Filing Date:
July 12, 2001
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
C08G61/02; C08G61/12; C08G65/40; C08G69/48; C08G85/00; H01B3/30; H01B3/42; (IPC1-7): C08G85/00; C08G65/40; H01B3/30; H01B3/42
Attorney, Agent or Firm:
Yoshio Kawaguchi
Mitsuru Inoue
Akio Ichiiri
Makoto Ono
Katsuma Osaki
Mitsuru Inoue
Akio Ichiiri
Makoto Ono
Katsuma Osaki