To provide a heat-resistant resin having low dielectric constant.

This polyimide composition is composed of a recurring unit represented by general formula (2) and is characterized by having 1,000-1,000,000 weight-average molecular weight. [In general formula (2), m, n, p, q are each a 1-4 integer; R1 and R2 are each H, F, CF3, a 1-20C alkyl group or a 6-20C aryl group; R3 and R4 are each H, F, CF3, a 1-20C alkyl group or a 5-20C cycloalkyl group, a 6-20C aryl group or a 5-20C cycloalkyl group obtained by binding R3 to R4; Ar is a 6-50C quadrivalent aromatic group selected from monocyclic or fused polycyclic aromatic group and nonfused polycyclic aromatic group where the above-mentioned aromatic groups are mutually bound either directly or via linkage group (s)].