Title:
低誘電率樹脂組成物及びこれを応用したフィルム及び回路基板
Document Type and Number:
Japanese Patent JP6822995
Kind Code:
B2
Abstract:
A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.
Inventors:
Su
Head neck
Xu Shiho
What an exhibition
Head neck
Xu Shiho
What an exhibition
Application Number:
JP2018045308A
Publication Date:
January 27, 2021
Filing Date:
March 13, 2018
Export Citation:
Assignee:
Ning Ding Technology Co., Ltd.
International Classes:
C08L101/12; C08G59/20; C08G59/40; C08G59/68; C08L15/00; C08L23/26; C08L45/00; C08L53/02; C08L63/00; C08L71/12; C08L79/08; H05K1/03
Domestic Patent References:
| JP2016538363A | ||||
| JP2013170214A | ||||
| JP2016089090A | ||||
| JP2010500750A |
Attorney, Agent or Firm:
try international patent corporation