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Title:
LOW DIELECTRIC INSULATING MATERIAL AND METHOD FOR PRODUCING IT
Document Type and Number:
Japanese Patent JP2009215466
Kind Code:
A
Abstract:

To provide a low dielectric insulating material and a method for producing it which can be molded by transfer molding, press-in molding, and injection molding, has a dielectric constant of 2.9 or less, and is excellent in adhesiveness with metal, drilling workability, sliding properties, and heat resistance.

The low dielectric insulating material is a thermoset product of a solventless resin kneaded material consisting of 20-50 vol% of a thermosetting resin component and 80-50 vol% of fluororesin powder. The method for producing the low dielectric insulating material includes a solventless resin kneaded material preparation process for blending 20-50 vol% of the liquid thermosetting resin component and 80-50 vol% of the fluororesin powder together and kneading the mixture in a vacuum condition without using any solvent to prepare the solventless resin kneaded material including no bubble, and a thermosetting process for thermosetting the solventless resin kneaded material to obtain the low dielectric insulating material.


Inventors:
KUSAKAWA KOICHI
MOTOI KAZUHIKO
Application Number:
JP2008061756A
Publication Date:
September 24, 2009
Filing Date:
March 11, 2008
Export Citation:
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Assignee:
NHK SPRING CO LTD
International Classes:
C08L27/12; B29B7/08; C08L35/00; C08L63/00; C08L101/00; H01B3/44; B29K27/12
Domestic Patent References:
JPH07314440A1995-12-05
JP2006263691A2006-10-05
JPH11269350A1999-10-05
JPH01123850A1989-05-16
JPH09330777A1997-12-22
JPH1180507A1999-03-26
JPH11269350A1999-10-05
JPH01123850A1989-05-16
JPH09330777A1997-12-22
JPH1180507A1999-03-26
JPH07314440A1995-12-05
JP2006263691A2006-10-05
Attorney, Agent or Firm:
Hiroaki Sakai