To provide a low dielectric insulating material and a method for producing it which can be molded by transfer molding, press-in molding, and injection molding, has a dielectric constant of 2.9 or less, and is excellent in adhesiveness with metal, drilling workability, sliding properties, and heat resistance.
The low dielectric insulating material is a thermoset product of a solventless resin kneaded material consisting of 20-50 vol% of a thermosetting resin component and 80-50 vol% of fluororesin powder. The method for producing the low dielectric insulating material includes a solventless resin kneaded material preparation process for blending 20-50 vol% of the liquid thermosetting resin component and 80-50 vol% of the fluororesin powder together and kneading the mixture in a vacuum condition without using any solvent to prepare the solventless resin kneaded material including no bubble, and a thermosetting process for thermosetting the solventless resin kneaded material to obtain the low dielectric insulating material.
MOTOI KAZUHIKO
JPH07314440A | 1995-12-05 | |||
JP2006263691A | 2006-10-05 | |||
JPH11269350A | 1999-10-05 | |||
JPH01123850A | 1989-05-16 | |||
JPH09330777A | 1997-12-22 | |||
JPH1180507A | 1999-03-26 | |||
JPH11269350A | 1999-10-05 | |||
JPH01123850A | 1989-05-16 | |||
JPH09330777A | 1997-12-22 | |||
JPH1180507A | 1999-03-26 | |||
JPH07314440A | 1995-12-05 | |||
JP2006263691A | 2006-10-05 |
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