Title:
LOW DIELECTRIC RESIN COMPOSITION, MOLDED ARTICLE, FILM, AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2022067926
Kind Code:
A
Abstract:
To provide a low dielectric resin composition which has good melt processability, is excellent in low dielectric characteristics, and especially exhibits a low dielectric loss tangent, a molded article and a film formed from the low dielectric resin composition, and a flexible printed wiring board including the above mentioned film.SOLUTION: A low dielectric resin composition contains graft-modified polyolefin (A), and a liquid crystal polymer (B), in which the low dielectric resin composition has a sea-island structure where an island phase as a discontinuous area is dispersed in a sea phase as a continuous area as a phase structure, and a graft copolymer of polyolefin and a vinyl monomer having an epoxy group is used as the graft-modified polyolefin (A).SELECTED DRAWING: Figure 1
Inventors:
KIKUSAWA AKIRA
IMAMURA YUICHI
IMAMURA YUICHI
Application Number:
JP2020176795A
Publication Date:
May 09, 2022
Filing Date:
October 21, 2020
Export Citation:
Assignee:
KANEKA CORP
International Classes:
C08L51/06; C08F255/00; C08L67/00; H05K1/03
Attorney, Agent or Firm:
Yuichi Niiyama
Ryuta Kato
Ryuta Kato