Title:
LOW DIELECTRIC RESIN COMPOSITION, MOLDING, FILM, AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2021161286
Kind Code:
A
Abstract:
To provide a low dielectric resin composition which has good melt processibility and is excellent in low dielectric characteristics in a high frequency band, a molding and a film composed of the low dielectric resin composition, and a flexible printed wiring board including the film composed of the low dielectric resin composition.SOLUTION: A low dielectric resin composition contains a liquid crystal polymer (A) and graft modified polyolefin (B) having a polar group, and is formed with such a sea island structure in which an island phase, which is a non-continuous region, is dispersed in a sea phase, which is a continuous region. The sea phase in the sea island structure is formed from any one of the liquid crystal polymer (A) and the graft modified polyolefin (B) having the polar group, and a size of the island phase is 20 μm or less.SELECTED DRAWING: Figure 1
Inventors:
KIDO MASAYOSHI
IMAMURA YUICHI
AKINAGA TAKAHIRO
IMAMURA YUICHI
AKINAGA TAKAHIRO
Application Number:
JP2020065225A
Publication Date:
October 11, 2021
Filing Date:
March 31, 2020
Export Citation:
Assignee:
KANEKA CORP
International Classes:
C08L101/12; C08F255/00; C08L23/26; C08L51/06; C08L67/03; H05K1/03
Attorney, Agent or Firm:
Yuichi Niiyama
Ryota Kato
Ryota Kato