To provide: a low dielectric resin composition having a dielectric constant and a dielectric loss tangent which are sufficiently low; a low dielectric film comprising the low dielectric resin composition; methods for producing the low dielectric resin composition and a low dielectric film; and a coating agent for a low dielectric film.

There are provided: (1) a low dielectric resin composition including hollow silica particles (C) dispersed in a matrix resin, the hollow silica particles having an average particle diameter of 0.05-3 μm, a porosity of 30-90%, and a BET specific surface area of less than 30 m2/g; (2) a low dielectric film comprising the low dielectric resin composition; (3) a method for producing the low dielectric resin composition including a step of preparing either hollow silica particles (A) containing air inside the particles or core-shell silica particles (B) enclosing a material eliminated upon firing to form hollow portions, firing the prepared product at a temperature exceeding 950°C to prepare the hollow silica particles (C), and preparing a dispersion in which the hollow silica particles are dispersed in a matrix resin forming material; and (4) an coating agent for a low dielectric film, the coating agent including the hollow silica particles (C) dispersed in a matrix resin forming material.