Title:
低誘電樹脂組成物、成形品、フィルム、積層フィルム、及びフレキシブルプリント配線板
Document Type and Number:
Japanese Patent JP7436467
Kind Code:
B2
Abstract:
The present disclosure provides a low dielectric resin composition having good melt processability and excellent low dielectric characteristics in a high frequency band as compared to low dielectric materials such as liquid crystal polymers. A molded article and a film, each of which is formed from the low dielectric resin composition, a multilayer film obtained by superposing a metal foil on at least one main surface of the film, and a flexible printed wiring board which includes the film are also provided. The present disclosure includes, as a low dielectric resin composition, a resin composition which contains (A) a liquid crystal polymer and (B) a graft-modified polyolefin having a polar group. The low dielectric resin composition has a dielectric constant of 2.80 or less at a frequency of 10 GHz and a dielectric loss tangent of 0.0025 or less at a frequency of 10 GHz.
Inventors:
Yuichi Imamura
Keisuke Okuma
Masayoshi Kido
Keisuke Okuma
Masayoshi Kido
Application Number:
JP2021516198A
Publication Date:
February 21, 2024
Filing Date:
April 23, 2020
Export Citation:
Assignee:
Kaneka Corporation
International Classes:
C08L67/03; C08F255/08; C08J5/18; C08L51/06; H05K1/03
Domestic Patent References:
| JP10330602A | ||||
| JP6073239A | ||||
| JP7062172A | ||||
| JP10258491A | ||||
| JP2002064030A |
Attorney, Agent or Firm:
Yuichi Niiyama
Ryuta Kato
Ryuta Kato
Previous Patent: electric pulse tools
Next Patent: Food or beverage products with aggregated pea protein
Next Patent: Food or beverage products with aggregated pea protein