To provide a polyimide resin composition by using inexpensive, high heat-resistant aromatic dicarboxylic dianhydride to obtain low thermal expansion polyimide and polyimide resin composition that is useful as a resin material for forming products or parts having a high level of low linear thermal expansion by using the above stated polyimide and further provide products or parts having excellent heat resistance by using the resin composition.

The polyimide has a recurring unit represented by formula (1) (wherein R1 to R6 are each H or a monovalent organic group wherein they may connect with each other, R7 is a divalent organic group) and the resin composition includes the polyimide and the articles are produced by using the resin composition at least partially.