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Title:
LOW FUSING POINT LEAD-FREE SOLDER, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2013081989
Kind Code:
A
Abstract:

To provide low melting point lead-free solder containing bismuth and tin as main components, excellent in tenacity, low in cost and having uniform distribution of bismuth and tin, and to provide a method for manufacturing the low melting point lead-free solder.

The low melting point lead-free solder includes first predetermined wt.% of bismuth and a metal group including second predetermined wt.% of tin and copper. The metal group consists of third predetermined wt.% of copper, 0-3 wt.% of silver and a remaining portion consisting of tin out of the second predetermined wt.%. The first predetermined wt.% is between 54 wt.% and 56 wt.%, the second predetermined wt.% is between 46 wt.% and 44 wt.%, and the third predetermined wt.% is between 0.6 wt.% and 0.8 wt.%.


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Inventors:
IJICHI SHOTO
OSHIMA KENICHI
Application Number:
JP2011224154A
Publication Date:
May 09, 2013
Filing Date:
October 11, 2011
Export Citation:
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Assignee:
SHIROGANE KK
METAL & TECHNOLOGY INC
International Classes:
B23K35/26; B22D21/00; C22C12/00; C22F1/16; C22F1/00
Domestic Patent References:
JP2000141079A2000-05-23
JPH1133775A1999-02-09
JP2001298270A2001-10-26
JP2003105465A2003-04-09
JPH08252688A1996-10-01
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Katsuomi Isogai
Satoshi Nazuka
Junpei Okada
Hideyuki Mori
Yukihiro Hotta



 
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