Title:
LOW MELTING POINT CU-AG ALLOY BRAZING FILLER METAL HAVING GOOD WETTABILITY
Document Type and Number:
Japanese Patent JP62024892
Kind Code:
A
Abstract:
PURPOSE: To stabilize the performance of a brazed part for a long period of time by incorporating a specific ratio each of Ag, Pd and Si and a specific ratio each of 1 or ≤2 kinds among Fe, Ni and Co and further a prescribed ratio of 1 or 2 kinds of Be and Li into a brazing filler metal.
CONSTITUTION: The Cu-Ag brazing filler metal contg. 25W65% Ag, 0.5W25% Pd, 0.25W6.5% Si and 1W10% 1 or ≥2 kinds among Fe, Ni and Co or further contg. 0.001W0.85 1 or 2 kinds of B and Li is produced by applying an ordinary melting method or plastic working method. The Cu-Ag alloy brazing filler metal obtd. in the above-mentioned manner has a low vapor presure and low m.p. as well as good wettability.
Inventors:
Yoshida, Hideaki
Morikawa, Masaki
Kishida, Kunio
Tanaka, Tadaharu
Morikawa, Masaki
Kishida, Kunio
Tanaka, Tadaharu
Application Number:
JP1986000077076
Publication Date:
February 02, 1987
Filing Date:
April 03, 1986
Export Citation:
Assignee:
MITSUBISHI METAL CORP
International Classes:
B23K35/30; C22C5/06; C22C5/08; C22C9/00; B23K35/30; C22C5/06; C22C9/00; (IPC1-7): B23K35/30; C22C5/06; C22C9/00
Previous Patent: PRODUCTION OF FLUX CORED WIRE FOR WELDING
Next Patent: LOW MELTING POINT CU-AG ALLOY BRAZING FILLER METAL HAVING GOOD WETTABILITY
Next Patent: LOW MELTING POINT CU-AG ALLOY BRAZING FILLER METAL HAVING GOOD WETTABILITY